Two powerful new application processors are expected to be unveiled soon. MediaTek’s Dimensity 9400 and Qualcomm’s Snapdragon 8 Gen 4 could both be introduced as soon as next month. Both will be built on TSMC’s second-generation 3nm process node (N3E) and each silicon wafer that is sliced and diced will cost MediaTek and Qualcomm $20,000 and up. The higher the price of the wafers, the higher the price of the chipsets.
Weibo post from leaker Digital Chat Station about pricing for the Snapdragon 8 Gen 4 and Dimensity 9400 APs. | Image credit-Weibo
As for the Dimensity 9400, Digital Chat Station says that its pricing will be a more affordable $155. The price gap between the Dimensity 9400 and the Snapdragon 8 Gen 4 could lead some phone manufacturers to use MediaTek’s AP. Last year, the Dimensity 9300 AP powered the Vivo X100 range and generated over $1 billion in revenue for MediaTek. The Dimensity 9400 AP will be powering the Vivo X200 line and Oppo’s Find X8 series among other devices.
The Dimensity 9400 is expected to be equipped with one Cortex-X925 CPU core running as fast as 3.36 GHz, three Cortex-X4 CPU cores with a clock speed up to 2.80 GHz, and four Cortex-A725 CPU cores running as fast as 2.10 GHz. The Snapdragon 8 Gen 4 will have two custom performance Oryon CPU cores clocked at 4 GHz along with six custom efficiency Oryon CPU cores with a clock speed up to 2.80 GHz.
