Taiwan Semiconductor Manufacturing Co. Ltd., better known as TSMC, is the world’s largest foundry. Only TSMC and Samsung currently mass-produce chips using their respective 3nm process nodes (which use different types of transistors as we will explain later). Apple is TSMC’s largest customer and is believed to account for a quarter of the company’s revenue (that’s 25% for you numerical types).
Apple reportedly has reduced its TSMC orders by as many as 120,000 wafers
A silicon wafer which is used to produce chips
Digitimes reports that TSMC has been able to beat out Samsung Foundry when it comes to signing up customers. Samsung’s 3nm node uses Gate-All-Around (GAA) transistors that allow the gate to come into contact with the channel on all sides resulting in less current leakage and higher drive current compared to the FinFET transistors used by TSMC for its 3nm node. GAA features vertically placed horizontal nanosheets while FinFET uses horizontally placed vertical “fins.” TSMC is expected to go to GAA for its 2nm production in 2025-2026.
Wafer prices have risen sharply over the years
The report says that in order to give Apple most of the 3nm production capacity later this year, Intel agreed to change its roadmap and delay receipt of its 3nm orders. TSMC’s enhanced 3nm process node (N3E) could be launched this year even though there might not be a big rush for orders considering the cost.
Intel has said that it will take process leadership from TSMC and Samsung by 2025 thanks to two developments. It will use RibbonFET transistors which is another term for the Gate-All-Around (GAA) transistors already employed by Samsung. And it will use a feature known as PowerVia or backside power delivery. This allows transistors to obtain power from one side of a chip while using the other side to connect to data communication links.
