Simpson wrote, “We think TSMC will move to normal wafer-based pricing on N3 with Apple during the first half of 2024, at around $16-17K average selling prices. At present, we believe N3 yields at TSMC for A17 and M3 processors are at around 55% [a healthy level at this stage in N3 development], and TSMC looks on schedule to boost yields by around 5+ points each quarter.”
TSMC’s yield on 3nm production is at 55% currently
The report from Arete Research says that the A17 Bionic requires 82 mask layers and with a die size in the range of 100-110 square mm, each wafer can yield 620 chips with a wafer cycle time of four months. That’s the time it takes a wafer lot (usually 25 wafers) to move from start to finish in a fab. The report added that the M3 chip is likely to be around 135-150 mm square die size and yield up to 450 chips per wafer.
This is a rumor, but even so, it isn’t clear whether Apple would stick with the N3B node to manufacture the A17 Bionic and M3, or switch to the less-expensive but slightly less impressive N3E node. If Apple decides to go with the N3E node, you might see prospective iPhone 15 Pro and iPhone 15 Pro Max buyers trying to figure out which variant of the A17 Bionic SoC is inside the phone they are about to buy.
