Apple is not going to significantly revise the SLP (substrate-like PCB) mainboard design for the iPhone 13 series this year, says DigiTimes in a report that’s largely centered on the PCB supply chain.
That’s not to say rigid-flex PCBs are inferior. In fact, they are said to be more efficient and reliable and are something of a gold standard for electronic items.
iPhone 13 will feature LCP-based flexible PCBs for mmWave 5G
Apple started veering towards LCP (liquid crystal polymer)-based flexible PCBs antenna modules in 2020. Previously, MPI (modified polyimide)-based models were used more commonly. LCP antennas perform better for high-speed data transmission and in millimeter waves, which makes them ideal for 5G connectivity.