MediaTek’s Dimensity 9300 AP features four Cortex-X4 prime CPU cores and four Cortex-A720 performance CPU cores. The lack of efficiency cores led many to worry about the chip overheating and it is currently powering the Vivo X100 series. The Dimensity 9400, expected later this year, is rumored to have a configuration made up of three prime Cortex-X5 cores and five Cortex performance cores.
The Snapdragon 8 Gen 4 will be built by TSMC using its enhanced 3nm process node. The Geekbench multi-core score was within a hair of the Apple M3 chip’s multi-core score of 10762 powering the MacBook Pro. The 3,133,570 AnTuTu score delivered by the Snapdragon 8 Gen 4 is also a score high enough to get phone enthusiasts excited at the possibilities for the Galaxy S25 Ultra next year.