MediaTek has introduced the Dimensity 1300, a new chipset it designed that will be built by TSMC using its 6nm process note. The chip designer says that the component “powers exceptional 5G smartphones with boosted AI performance and new MediaTek HyperEngine 5.0 gaming technologies to give incredible, everyday smartphone experiences.” The SoC will supposedly power the OnePlus Nord 2T/3.
The Dimensity 1300 will include a 9 core Arm Mali-G77 MC9 GPU. The SoC comes with HyperEngine 5.0 providing a suite of gaming-related optimizations such as exclusive AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, plus wireless earbud latency improvements from Bluetooth LE Audio technology. The chipset improves AI performance including AI photography features like night shot photography, HDR for improved image clarity, and a 40% improvement in dynamic range using Staggered 4K HDR video.
MediaTek introduces the Dimensity 1300, an AP built by TSMC using its 6nm process node
MediaTek’s Dimensity 1300 will support displays that refresh at fast rates to deliver “zero-lag visuals in gaming, plus notably improved everyday experiences from smoother scrolling of webpages, social streams, and animations in apps.” Integrated into the chip is a 5G modem and support for 5G enhancements such as carrier aggregation. According to MediaTek, this helps its chips deliver the fastest download speeds over sub-6GHz 5G networks.
“The Dimensity 5G family powers the highest-end smartphones but brings flagship 5G technology to the mass market, so everyone can experience the power of 5G,” says the chip designer. “MediaTek brings 5G to devices everywhere – not just smartphones – but PCs, routers, mobile hotspots and more. With Dimensity, you can always expect incredible 5G experiences.”
