The Dimensity 9400 application processor (AP) is expected to feature a configuration consisting of one Cortex-X5 super CPU core running up to 3.4GHz, three Cortex-X4 super CPU cores with a clock speed as high as 2.96GHz, and four Cortex-A720 efficiency-performance CPU cores running as fast as 2.27GHz. Once again, MediaTek will offer a flagship AP without any low-power efficiency cores. It is expected to deliver a 30% improvement in performance over its predecessor.
Post from leaker Digital Chat Station stating that the Dimensity 9400 processor will be out earlier than expected. | Image credit-Weibo
Digital Chat Station expects the first phones carrying the Snapdragon 8 Gen 4 to premiere in November or December giving the MediaTek powerhouse anywhere from a two-week to six-week head start over Qualcomm’s upcoming flagship AP. MediaTek’s CEO, Rick Tsai, says that he expects the success of the Dimensity 9400 to hike the company’s revenues by 50%. The chip will be produced by leading foundry TSMC using its second-generation 3nm process node (N3E).
The post from Digital Chat Station also mentions a lower priced Dimensity 8400 chipset that would be used by phones in a slightly lower-price range than the flagship models running the Dimensity 9400. The chip might be the largest AP ever made for a smartphone and is rumored to include 30 billion transistors.
