So, what’s the big deal? Let’s break it down:
Super smart sound: These platforms use on-device AI to make the audio experience personalized and responsive. AI is leveraged in applications like improving phone call quality or optimizing the active noise cancellation profile depending on the user’s environment. The new chips deliver six times the compute power and almost 100 times more AI power compared to previous-gen platforms.
And here’s the best part – Wi-Fi magic: The S7 Pro is special because it can switch seamlessly between Bluetooth and Wi-Fi in cases when you are far away from your phone or computer. This greatly extends the connection range compared to using Bluetooth only – you can walk around your house or campus, listening to music or having a call without any interruptions.
No compromise on quality: If you’re a fan of top-notch music quality, these platforms support up to 24bit, 192kHz lossless music. While Bluetooth alone simply lacks the bandwidth to allow lossless audio transmission, Wi-Fi on the S7 Pro can zoom at up to 29Mbps – more than enough to stream Hi-Res audio via services like Tidal.
Dino Bekins, the VP and GM at Qualcomm, says “These platforms set a new benchmark for high-performance sound at ultra-low power. They are packed with premium technologies that work together with on-device AI to deliver immersive and personalized audio experiences wherever you go – whether in a meeting, socializing, gaming, listening to music or just needing some quiet time”
Qualcomm’s latest state of report found that people care a lot about the audio quality. Nearly 73 percent of folks said that they want a better sound quality with each new device they buy. And 69 percent are looking for lossless audio quality in their next earbuds.
So, get ready for a new era of sound. The first product harnessing the power of these revolutionary chips is expected to arrive in 2024, with audio giant BOSE among the first companies to use them in their products.
