That being said, a recent rumor hints that we might see an Exynos 2400 in the last quarter of this year. This comes from tipster Tech_Reve on Twitter, who says the new Samsung chipset will be built using a packaging technology called fan-out wafer-level packaging, or FoWLP. (via Android Headlines)
The tipster goes on to clarify that FoWLP tech allows for the manufacturer to skip using a printed circuit board (PCB), resulting in thinner semiconductors with higher performance, as the chip is mounted straight to the silicon wafers. If we follow the logic here, this should translate to better device performance with higher power efficiency.
Will the Galaxy S24 series come with an Exynos chip?
Despite these rumors, it is rather unlikely that Samsung will go back to adding Exynos chips to its flagship phones. The company has already signed a contract with Qualcomm for several years, and it is hard to imagine that it would go back on such a significant change in its manufacturing process.
More likely is that — if it’s actually real — this supposed Exynos 2400 chip will be included in other Android devices. For example, there has already been word that the upcoming Pixel 8 Pro might rock an Exynos chipset from Samsung, albeit modified. There is also a slight chance they might be used in some of the company’s other phones, like the Galaxy FE series.
All of these are just rumors at this point, though, so make sure you don’t take them too seriously yet. There is plenty of time for more information to leak so we get a fuller picture of what Samsung is planning to do with its own silicon in the future.
