From previous rumors, we already know that the chip will be based on TSMC’s 5nm process, which would make it more powerful and energy-efficient than the Snapdragon 865, which is built on 7nm nodes.
The X60 5G modem will probably be embedded within the Snapdragon 875
Currently, Qualcomm is said to be investing around 6,000 to 10,000 5nm wafers every month and TSMC is expected to deliver both the SoC and the modem by September. That’s not to say that the chipmaker will launch the next-gen chip in September. So, don’t expect any Snapdragon 875-powered phone in 2020, as the silicon will supposedly not go official before December.
In laymen’s terms, the new chip will offer better performance and reduced power consumption.